| Circuit board PCB Machining process as a special field | | | | (Photo-Via), further chemical plating of copper with an |
| in the PCB industry, the people, for the PCB copy | | | | overall increase in copper conductor layer, but also by |
| board, PCB design related process must be skilled, | | | | line imaging and etching, get new wires and |
| professional PCB copy through our panel of people in | | | | interconnect with the underlying buried holes or blind |
| the conclusion, we have a professional PCB copy | | | | holes. Repeat this additional layer will receive the |
| board of experts come to the following lines board | | | | required number of layers of multilayer boards. This |
| PCB processing special process in the hope of the | | | | method not only can avoid costly mechanical drilling |
| PCB industry to help. | | | | costs, and its pore size can be reduced to 10mil even |
| AdditiveProcess Addition Refers to non-conductive | | | | less. Over the past 5 to 6 years, all by breaking the |
| substrate surface, the additional resist the assistance | | | | tradition changed to successive layers of multilayer |
| of the local chemical copper layer conductor lines, the | | | | technology industry in the United States and Japan |
| growth process directly (see Board Information Journal, | | | | continue to push under, making these BuildUpProcess |
| No. 47, P.62). PCB copy board plus method used can | | | | fame, has more than ten kinds of products the market |
| be divided into full addition, half of Addition and part of | | | | Zheyi more. In addition to the above-mentioned |
| the addition of other different ways. | | | | "Photographic hole" outside; there after the removal of |
| Backpanels, Backplanes support plate Is thicker (eg, | | | | copper holes for basic organic chemicals bite plate |
| 0.093 ", 0.125") of the circuit board, specifically for the | | | | hole, laser hole burning (LaserAblation), and plasma |
| plug to contact the other board. The approach is to | | | | etching holes (PlasmaEtching) so different "as hole |
| first insert a multi-pin Connector (Connector) a tight | | | | "approach. But also can also be made of |
| hole, but do not solder, but across the board in the | | | | semi-hardened resin coating of the new "gum foil" |
| connector pins on each lead, then one by one cable | | | | (ResinCoatedCopperFoil), using successive lamination |
| winding means. Connector on the PCB can be copied | | | | method (SequentialLamination) made in a more |
| into the general board. Because of this particular board, | | | | intensive small and thin multilayer. A variety of personal |
| the hole can not solder, but the cell wall and lead to | | | | future Electronic Products, will be the light of this real |
| direct clamping needle to use, so the quality and | | | | world short multilayer. |
| aperture requirements are particularly stringent, their | | | | Cermet Cermet, ceramic powder and metal powder |
| orders are not a lot of general circuit board are | | | | mixture, then add as a kind of bonding agent Paint Can |
| unwilling to not easy to take such orders, in the United | | | | the circuit board (or the inner upper) to thick or thin film |
| States has almost become a high-grade and | | | | of printing, as a "resistor" of the cloth was placed to |
| specialized business. Additional layer of legal process | | | | replace the assembly of the external resistor. |
| BuildUpProcess This is a new area of thin multilayer | | | | Co-Firing of fire |
| approach, the first is from IBM's SLC enlightenment | | | | A ceramic hybrid circuit board PCB (Hybrid) of a |
| process, by its Japan Yasu plant started trial | | | | process, the surface of the small plates have been |
| production in 1989, the law is for the traditional | | | | printed all kinds of precious metal thick film paste |
| two-panel basis, since the two first-round outer | | | | (ThickFilmPaste) line, placed in the firing temperature. |
| surface coating of liquid photosensitive precursors | | | | To make thick paste in a variety of organic carriers |
| such as Probmer52, by the semi-hardened and | | | | were burned, leaving precious metals conductor lines |
| sensitive Jie Xiang, make a shallow connected with the | | | | to as the interconnect wire. |
| next low-level form "Photographic pilot hole" | | | | |